Technical capability
ITEM
|
Specification
|
Comments
|
|
Layer counts
|
Flexible PCB
|
1-10 Layers
|
|
Rigid-Flex PCB
|
2-16 Layers
|
||
HDI PCB
|
2+N+2 Layers
|
||
Copper Thickness
|
6um min
|
||
4oz max
|
|||
PNL Size(maximum)
|
610*914mm
|
||
Hole Diameter
|
Laser drilling
|
0.05mm
|
|
Mechanical drilling
|
0.15mm
|
||
Hard tooling Hole
|
0.50mm
|
||
Aspect Ratio(maximum)
|
Through hole
|
10:1
|
|
Blind hole
|
2:1
|
||
Line (minimum)
|
1/3oz Copper
|
1.2mil
|
LDI
|
0.5oz Copper
|
1.5mil
|
||
0.5oz Copper
|
2mil
|
Film exposure
|
|
1oz Copper
|
3mil
|
||
2oz Copper
|
4mil
|
||
Surface Treatment
|
In Plant
|
ENIG、Gold Plating、Pure Tin Plating
|
|
Outsourcing
|
ENEPIG、Immersion silver、OSP、Immersion tin
|
||
Dimension&Tolerances
|
Hole Size
|
±0.05mm
|
H≦2.0mm
|
Line
|
±10%
|
W≧0.25mm
|
|
Accumulate tolerance
|
±0.05mm
|
W<0.25mm
|
|
Line to outline
|
±0.05mm
|
P≦25mm
|
|
Outline tolerance
|
±0.05mm
|
C≦5.0mm
|
|
Impedance tolerance
|
±10%
|
|
|
Connectivity test
|
Resistance(minimum)
|
0.5mΩ
|
Four lines
|
Resistance(minimum)
|
5Ω
|
Ordinary
|
|
Insulation Resistance
|
50MΩ
|
Ordinary
|

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